EB Film & Adhesive Crosslinking

Low-energy electron beams can be used to crosslink films, adhesive layers, and multilayer materials to improve forming stability, heat resistance, and long-term performance.

For food packaging films, shrink films, VSP films, and industrial tapes, the key is not simply applying a higher dose, but controlling electron penetration and dose distribution according to the target layer. This allows the outer layer or adhesive layer to achieve the required crosslinking while minimizing the effect on heat-seal layers, barrier layers, substrates, release layers, and other functional layers.

Based on material thickness, layer structure, and target performance, EBC can support dose-depth evaluation, sample irradiation, roll-to-roll pilot trials, and EBR production system configuration to improve heat resistance, puncture resistance, cohesive strength, high-temperature adhesion, and long-term performance, depending on the application.